To provide a polishing pad capable of sustaining stabilized polishing characteristics even if it is used over a long time by performing polishing while suppressing occurrence of micro polishing scratches when the surface of an interlayer insulating film, a BPSG film, a shallow trench isolating isolation film, a capacitor ferroelectric film, an interconnection metal film, or an article being polished is polished and planarized, or when a buried layer is formed.
The polishing pad for polishing the surface of an article is produced by integrally hot pressing a layer of a sheet-like organic fibers basic material holding resin wherein the organic fibers are fixed through substantially non-foaming resin. Content of resin is 25.3-40.3 mass% and the organic fibers are exposed at least on one surface.
SHIMAMURA YASUO
IWATSUKI YASUHITO
TAKAHASHI KATSUHARU
SHIN KOBE ELECTRIC MACHINERY
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