Title:
POLISHING PAD AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2023124056
Kind Code:
A
Abstract:
To provide a polishing pad which has appropriate collapsibility, and thereby can maintain a stable polishing rate, and can obtain a polished object having low surface roughness, and a method for manufacturing the same.SOLUTION: A polishing pad includes a base material, and a polishing part arranged on the base material, wherein the polishing part contains a resin, polishing particles, and spacer particles, an average particle diameter D1 of the spacer particles is 5.0-20 μm, and an aspect ratio (average major axis diameter/average minor axis diameter) of the spacer particles is 2.0-12.SELECTED DRAWING: Figure 1
Inventors:
KOIKE KENICHI
OKADA SHINJI
KAJIWARA KAZUE
NAGAI KATSUKI
TAKAGI MASATAKA
OKADA SHINJI
KAJIWARA KAZUE
NAGAI KATSUKI
TAKAGI MASATAKA
Application Number:
JP2022027622A
Publication Date:
September 06, 2023
Filing Date:
February 25, 2022
Export Citation:
Assignee:
FUJIBO HOLDINGS INC
International Classes:
B24D11/00; B24D3/00; H01L21/304
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito