To provide a polishing pad and a polishing method, capable of performing polishing well even if the polished surface of a work to be surface- treated such as a large-aperture semiconductor wafer has the large area.

A polishing pad 10 is constituted by sticking a soft porous sheet 12 to serve as an absorbing, holding and discharging layer for abrasive fluid L onto the lower surface of a polishing cloth 11 on which many through holes 11A are provided at specified pitches. In a polishing method, the polishing pad 10 is fixed on the front surface of a polishing surface plate 31 so that the polishing cloth 11 side may face to the outside, and abrasive fluid is supplied onto the front surface of the polishing pad 10 in the downstream polishing surface plate which has polished the semiconductor wafer.