Title:
POLISHING PAD, MOUNT AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2023092653
Kind Code:
A
Abstract:
To provide a polishing pad that can suppress polishing agents from being insufficiently supplied partially.SOLUTION: A polishing pad, which is attached to a polishing device that polishes a work-piece, comprises: a disk-like base including a first surface and a second surface and having a concave part formed on the first surface side, a porous member provided in the concave part of the base, a polishing layer fixed to the second surface side of the base, and a plurality of penetration holes connected to the porous member while penetrating through the polishing layer, in which polishing agents supplied to the porous member are supplied to the plurality of penetration holes.SELECTED DRAWING: Figure 1
Inventors:
KOJIMA KATSUYOSHI
Application Number:
JP2021207803A
Publication Date:
July 04, 2023
Filing Date:
December 22, 2021
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B37/12; B24B37/00; B24B41/047; B24B45/00; H01L21/304
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato
Tomohiro Okamoto
Takahiro Kasahara
Hideaki Okamoto
Takayuki Okano
Toshikazu Imato