To provide a polishing pad which can effect uniform pressure to a polishing agent between the polishing surface of the polishing pad and a surface to be polished of a workpiece over a wide area on the surface to be polished of the workpiece when the polishing pad is rotated around a rotary shaft passing through the center of the polishing pad in order to polish the workpiece with the use of the polishing agent.
The polishing surface of a polishing pad, adapted to be used for feeding the polishing agent from the center part to the peripheral part of the polishing pad, is formed therein with grooves 1 having their leading ends located in the center part 3 of the polishing surface and their trailing ends located at the outer edge 4 of the polishing surface, and having a cross-sectional area which is changed from their leading ends to the trailing ends so as to be maximum in their middle positions. With this arrangement, in the polishing part 2 of the polishing pad for polishing a workpiece, the pressure of the polishing agent can be uniformly maintained in a wide range extending from the center part to the outer peripheral part of the polishing surface.
YUGAWA MITSUYUKI
OKUYA NORIO
