To provide a polishing pad containing a large amount of polishing components, capable of almost completely controlling a quantity, a size, and a shape of a hole holding, supplying, and discharging slurry, to be capable of eliminating necessity for renewing a polishing surface or reducing a number of times of renewal.
A photo molding device is used, 20 layers are successively layered while hardening each 100 μm a photo hardening resin containing cerium oxide, to obtain a polishing pad having a hole opened to a polishing surface, a pipe communicating with at least partly this hole to be formed in a horizontal direction, and a groove formed in a reverse surface. Shape and size of the formed hole and a number of the holes are almost completely controlled in the polishing pad, to be similarly controlled in also the polishing pad of different lot. Consequently, polishing can be applied with no supply of abrasive grains, in addition polishing of very high uniformity can be applied. Particularly, a discharge capacity of spent slurry is high obtained.
HASEGAWA TORU
KURIHARA FUMIO
Next Patent: POLISHING PAD FOR SEMICONDUCTOR WAFER