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Patent Searching and Data


Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2009136935
Kind Code:
A
Abstract:

To solve a problem wherein a circumferential velocity difference between an inner circumference part and the outer circumference part of a carrier causes an accuracy difference in the surface roughness, parallelism and flatness in a single work in a conventionally used polishing pad whose diameter of openings on the surface is same and whose carrier of a planetary gear type polishing device executes circular movement of autorotation and revolution.

The polishing pad is formed into a doughnut-like shape and changes the opening diameters so as to reduce the dispersion of the surface roughness of the polishing surfaces of the outer circumference part and the inner circumference part and uniformize the accuracy of the parallelism and the flatness, thereby improving the manufacturing efficiency.


Inventors:
TANAKA SATOSHI
NAKAMURA SHINJI
TOYODA KAZUHIKO
Application Number:
JP2007313198A
Publication Date:
June 25, 2009
Filing Date:
December 04, 2007
Export Citation:
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Assignee:
CHIYODA KK
HAMAI SANGYO
International Classes:
B24B37/24; B24B37/26; H01L21/304