Title:
POLISHING PAD
Document Type and Number:
Japanese Patent JP2022057476
Kind Code:
A
Abstract:
To provide a polishing pad that can improve sagging of an end part, without changing a physical property/bubble structure of a polishing layer.SOLUTION: A polishing pad 3 comprises a polishing layer 4 having a polishing surface for polishing an object to be polished. In the polishing surface are provided a slurry holding groove formed in a shape for holding slurry and a slurry ejection groove formed in a shape for ejecting slurry. A ratio of mass of the slurry ejection groove to mass of the slurry holding groove (ejection groove mass/holding groove mass) is 0.5-1.0.SELECTED DRAWING: Figure 1
Inventors:
TATENO TEPPEI
MATSUOKA RYUMA
KURIHARA HIROSHI
NARUSHIMA SATSUKI
TAKAMIZAWA YAMATO
MATSUOKA RYUMA
KURIHARA HIROSHI
NARUSHIMA SATSUKI
TAKAMIZAWA YAMATO
Application Number:
JP2020165755A
Publication Date:
April 11, 2022
Filing Date:
September 30, 2020
Export Citation:
Assignee:
FUJIBO HOLDINGS INC
International Classes:
B24B37/26; B24B37/24; C08J5/14; H01L21/304
Attorney, Agent or Firm:
Youichiro Uemura