PURPOSE: To improve roughness of a polished surface by polishing, by providing shallow grooves with a small distance between the grooves and deep grooves with a large distance between the grooves on a polishing surface of a polishing surface plate so as to enable a detached abrasive grain and a surplus abrasive grain, in no direct relation to the polishing, to be removed and discharged and prevent the polished surface from flawing.
CONSTITUTION: A polishing surface plate, in which shallow grooves 6 with a small distance between the grooves are formed in a V-shape and an abrasive grain 7 buried into a crest part of said groove is dropped into the V-shaped shallow groove 6 if the abrasive grain 7 is detached due to the polishing pressure or the like, prevents a workpiece from flawing becuase the abrasive grain is never entangled in a part between the workpiece and the polishing surface plate. And an abrasive grain 4 dropped into the shallow groove 6 passes through in the shallow groove going into a deep groove 5 with a large distance between the grooves. While an abrasive grain detached by centrifugal force of the rotating polishing surface plate and action of the rotating workpiece is discharged with abrasive fluid. While a surplus abrasive grain in no direct relation to the polishing is similarly discharged passing through the shallow and the deep grooves. Accordingly, roughness of the polished surface is improved.
| JP3998657 | Substrate polishing method and equipment |
| JP2005329513 | DOUBLE-SIDE POLISHING DEVICE |
MORIWAKI TSUTOMU
MAKI YOSHIROU
| JPS60142063U | 1985-09-20 |