Title:
研磨ホイールユニット及び研磨ホイール
Document Type and Number:
Japanese Patent JP7277905
Kind Code:
B2
Abstract:
To provide a polishing wheel unit which can execute high efficient polishing work, and can suppress occurrence of uneven polishing, scratches on an abrasive layer, or the like.SOLUTION: A polishing wheel unit, which is mounted on a head of a polishing device, comprises a cone 21, and a polishing wheel 22. The polishing wheel 22 has: a cylindrical core part 221; an elastic part 222 which has a cylindrical shape, and is tightly joined to an outer peripheral surface of the core part 221; and an abrasive layer ring part which has a cylindrical shape and is tightly joined to an outer peripheral surface of the elastic part 222, and in which an abrasive layer is provided on a ring outer peripheral surface 223a. In the polishing wheel 22, a force Fadded from a radial outer side can be buffered by elastic deformation of the elastic part 222.SELECTED DRAWING: Figure 4
Inventors:
Hisayuki Murata
Application Number:
JP2019027233A
Publication Date:
May 19, 2023
Filing Date:
February 19, 2019
Export Citation:
Assignee:
Sanwa Polishing Industry Co., Ltd.
International Classes:
B24B45/00; B24D3/00; B24D5/00
Domestic Patent References:
| JP49022577U | ||||
| JP5881802B1 | ||||
| JP200450400A | ||||
| JP2006326795A | ||||
| JP3047758U | ||||
| JP11262863A |
Foreign References:
| US6471733 |
Attorney, Agent or Firm:
Masataka Kotani
Tsutomu Fukunari
Tsutomu Fukunari
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