Title:
ポリアセタール樹脂組成物及びその成形品
Document Type and Number:
Japanese Patent JP5317312
Kind Code:
B2
Abstract:
A polyacetal resin composition comprising (A) 100 parts by mass of polyacetal resin generating formaldehyde in an amount of not more than 100 ppm when heated at a temperature of 200° C. for 50 minutes under the nitrogen atmosphere and (B) 0.01 to 5 parts by mass of a hydrazide compound can provide an article which is remarkably reduced in an emission amount of formaldehyde even though molded either at a higher temperature or under molding conditions wherein the resin temperature rises partially. Therefore, the polyacetal resin composition can be molded according to various molding methods and under a wide range of molding conditions. The article molded from the resin composition has succeeded in reducing the emission amount of formaldehyde, measured according to VDA275 method, to not more than 1 mg/kg, the level never achieved before, and therefore is usable for various applications where a reduced VOC is required.
Inventors:
Sumio Komatsu
Yukiyoshi Sasaki
Yukiyoshi Sasaki
Application Number:
JP2005514963A
Publication Date:
October 16, 2013
Filing Date:
October 21, 2004
Export Citation:
Assignee:
Asahi Kasei Chemicals Corporation
International Classes:
C08L59/00; C08G2/28; C08K5/25
Domestic Patent References:
| JP2000159850A | 2000-06-13 | |||
| JPH10298401A | 1998-11-10 | |||
| JPH1036630A | 1998-02-10 | |||
| JPH04345648A | 1992-12-01 |
Foreign References:
| WO2003050186A1 | 2003-06-19 | |||
| WO2000017247A1 | 2000-03-30 | |||
| WO2001002453A1 | 2001-01-11 | |||
| WO1998042781A1 | 1998-10-01 |
Attorney, Agent or Firm:
Masami Sakai
Norio Kagami
Yoshikuni Suda
Norio Kagami
Yoshikuni Suda