Title:
POLYACETAL RESIN COMPOSITION AND RESIN-MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2007051205
Kind Code:
A
Abstract:
To provide a polyoxymethylene resin composition excellent in molding characteristics (releasing property, molding cycle), and also suppressing the amount of formaldehyde generation.
This polyacetal resin composition is obtained by blending (B) 0.01-20 pt./pts.wt. mixture of 1 kind or ≥2 kinds selected from (b-1) a guanamine compound and (b-2) a hydrazide compound and (C) 0.1-5 pt./pts.wt. ester compound having ≥50% esterifying rate based on (A) 100 pts.wt. polyacetal copolymer having ≤1 mmol/kg hemi-formal terminal group amount, ≤2 mmol/kg formyl terminal group amount and ≤0.5 wt.% unstable terminal amount.
Inventors:
WADA SHOGO
KURITA HAYATO
KURITA HAYATO
Application Number:
JP2005236769A
Publication Date:
March 01, 2007
Filing Date:
August 17, 2005
Export Citation:
Assignee:
POLYPLASTICS CO
International Classes:
C08L59/00; C08K5/10; C08K5/25; C08K5/3477
Domestic Patent References:
| JP2003113289A | 2003-04-18 | |||
| JP2005112995A | 2005-04-28 | |||
| JPH0841288A | 1996-02-13 | |||
| JPH05156118A | 1993-06-22 | |||
| JP2001011143A | 2001-01-16 |
Foreign References:
| WO2004058884A1 | 2004-07-15 | |||
| WO2004096910A1 | 2004-11-11 | |||
| WO2004058875A1 | 2004-07-15 |
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa