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Title:
POLYACETAL RESIN COMPOSITION AND MOLDED ARTICLE
Document Type and Number:
Japanese Patent JP2007091973
Kind Code:
A
Abstract:

To provide stable polyacetal resin composition that can control the amount of generated formaldehyde to an extremely low level and also causes no adverse effect on other resin molded articles existing together in a tightly closed space.

The polyacetal resin composition includes (B) 0.01 to 5.0 pts.wt. of a carboxylic acid hydrazide based on (A) 100 pts.wt. of a polyacetal resin, wherein (B) the carboxylic acid hydrazide generates less than 10 ppm of hydrazine according to the head space GC/MS method by heating at 200°C for 10 minutes.


Inventors:
KAWAGUCHI KUNIAKI
Application Number:
JP2005286138A
Publication Date:
April 12, 2007
Filing Date:
September 30, 2005
Export Citation:
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Assignee:
POLYPLASTICS CO
International Classes:
C08L59/00; C08K5/25
Domestic Patent References:
JP2002035098A2002-02-05
JPH1036681A1998-02-10
JPH04345648A1992-12-01
Foreign References:
WO2005044916A12005-05-19
WO2001062309A12001-08-30
WO2001039808A12001-06-07
WO2001005888A12001-01-25
WO2005033201A12005-04-14
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa



 
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