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Title:
POLYACETAL RESIN COMPOSITION, AND MOLDED ARTICLE THEREOF
Document Type and Number:
Japanese Patent JP2012107150
Kind Code:
A
Abstract:

To provide a polyacetal resin composition which is less likely to generate formaldehyde derived from decomposition of a polyacetal resin, and is less likely to contaminate a metal mold.

The polyacetal resin composition contains 100 pts.mass of (A) a polyacetal resin, 0.01 to 5 pts.mass of (B) a hydrazide compound, and (C) a compound having a carboxyl group or a polyester of 0.07 to 30 mmol in terms of carboxyl group to 1 g of the (A) polyacetal resin.


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Inventors:
FUJIMOTO KUNIHIKO
Application Number:
JP2010258488A
Publication Date:
June 07, 2012
Filing Date:
November 19, 2010
Export Citation:
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Assignee:
MITSUBISHI ENG PLASTICS CORP
International Classes:
C08L59/04; C08K5/09; C08K5/25; C08L67/00
Domestic Patent References:
JP2005112995A2005-04-28
JP2000239484A2000-09-05
JP2010174236A2010-08-12
JP2009029863A2009-02-12
JP2005163019A2005-06-23
Attorney, Agent or Firm:
Kenji Kawabi



 
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