Title:
ポリアセタール樹脂組成物および樹脂成形品
Document Type and Number:
Japanese Patent JP6541578
Kind Code:
B2
Abstract:
Provided is a polyacetal resin composition in which at least one dihydrazone compound (B) selected from the group selected from a dihydrazone compound (B1) represented by the following General Formula (1) and a dihydrazone compound (B2) represented by the following General Formula (2) is blended in 0.02 to 5 parts by mass with respect to 100 parts by mass of a polyacetal resin (A).
(In the above formula, R 1 represents an aliphatic hydrocarbon group having 4 to 20 carbon atoms, or the like; R 2 to R 5 each independently represent an alkyl group having 1 or 2 carbon atoms, or the like; at least one of R 2 and R 3 represents an alkyl group having 1 or 2 carbon atoms; and at least one of R 4 and R 5 represents an alkyl group having 1 or 2 carbon atoms.)
(In the above formula, R 8 represents an aliphatic
Inventors:
Makiko Oshima
Kunihiko Fujimoto
Masayuki Nagai
Hidetoshi Nakata
Takanori Sato
Ryusuke Tamaki
Kunihiko Fujimoto
Masayuki Nagai
Hidetoshi Nakata
Takanori Sato
Ryusuke Tamaki
Application Number:
JP2015559936A
Publication Date:
July 10, 2019
Filing Date:
January 27, 2015
Export Citation:
Assignee:
Mitsubishi Engineering Plastics Co., Ltd.
Nippon Finechem Co., Ltd.
Nippon Finechem Co., Ltd.
International Classes:
C08L59/00; C08K5/30
Domestic Patent References:
JP2009084369A | ||||
JP2005325225A | ||||
JP2005137785A | ||||
JP2005336304A | ||||
JP2007070574A | ||||
JP2014501827A |
Attorney, Agent or Firm:
Hiroaki Aoki
Yasuo Morimura
Yasuo Morimura
Previous Patent: ミエリン障害の治療のための誘導多能性細胞由来オリゴデンドロサイト前...
Next Patent: 薬物送達デバイスのピストンロッドのための支承部部品、支承部部品を含...
Next Patent: 薬物送達デバイスのピストンロッドのための支承部部品、支承部部品を含...