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Title:
POLYACETAL RESIN COMPOSITION AND MOLDING OBTAINED FROM THIS COMPOSITION
Document Type and Number:
Japanese Patent JP2007177048
Kind Code:
A
Abstract:

To obtain a polyacetal resin composition containing a thickener for dramatically increasing melt viscosity of a polyacetal resin, for enabling stable fabrication in injection molding, extrusion molding, etc., and for obtaining a molding having good surface characteristics and excellent impact resistance, and to solve problems such as thermal fusion in a drying process in case of producing a low molecular weight polymer, poor filtrability at the time of dehydration, and lowering of melt viscosity due to hydrolysis in case of fabricating the polyacetal resin.

This polyacetal resin composition comprises 0.1-50 pts.wt. thickener (B), which is obtained by coating 100 pts.wt. polymer particles (B-1) having a glass transition temperature of ≥60°C, a volume-average particle diameter in a range of 50-500 μm, and reactivity with a polyacetal resin, with 0.5-30 pts.wt. polymer particles (B-2) having a volume-average particle diameter of 0.01-0.5 μm, to 100 pts.wt. polyacetal resin (A). The molding is obtained from the composition.


Inventors:
SUNAKAWA TAKENOBU
Application Number:
JP2005375869A
Publication Date:
July 12, 2007
Filing Date:
December 27, 2005
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08L59/00; C08F20/10; C08F212/00; C08F265/06



 
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