Title:
POLYACETAL RESIN COMPOSITION AND MOLDING THEREOF
Document Type and Number:
Japanese Patent JP2017165835
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyacetal resin composition that resists decreasing of melt viscosity when the polyacetal resin composition is molded, and has excellent moist heat resistance, and provide a molding thereof.SOLUTION: A polyacetal resin composition comprises polyacetal resin (A) 100 pts.mass, organic phosphate compound represented by general formula (1) (B) 0.001-5.0 pts.mass, and layered double hydroxide represented by general formula (2) (C) 0.001-5.0 pts.mass.SELECTED DRAWING: None
Inventors:
SUNAGA DAISUKE
ITO AKIRA
ITO AKIRA
Application Number:
JP2016051063A
Publication Date:
September 21, 2017
Filing Date:
March 15, 2016
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L59/00; C08K3/22; C08K5/13; C08K5/17; C08K5/3492; C08K5/524
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