Title:
POLYACETAL RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2007070575
Kind Code:
A
Abstract:
To provide a polyacetal resin composition capable of suppressing a formaldehyde emission to a very low level and of suppressing mold deposit and bleed-out coming from additives.
The polyacetal resin composition is prepared by formulating (A) 100 pts.wt. polyacetal resin with (B) 0.01 to 5.0 pts.wt. specified hydrazide compound.
Inventors:
KAWAGUCHI KUNIAKI
Application Number:
JP2005262312A
Publication Date:
March 22, 2007
Filing Date:
September 09, 2005
Export Citation:
Assignee:
POLYPLASTICS CO
International Classes:
C08L59/00; C08J5/00; C08K5/29
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa
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