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Title:
POLYACETAL RESIN COMPOSITION AND MOLDING
Document Type and Number:
Japanese Patent JP2007145980
Kind Code:
A
Abstract:

To obtain a polyacetal resin composition that controls an amount of formaldehyde generated to an extremely low level and controls a mold deposit derived from an additive.

The polyacetal resin composition comprises (A) 100 parts wt. of a polyacetal resin and (B) 0.01-5.0 parts wt. of a pyrazole compound containing a specific -NH2 group.


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Inventors:
KAWAGUCHI KUNIAKI
Application Number:
JP2005341918A
Publication Date:
June 14, 2007
Filing Date:
November 28, 2005
Export Citation:
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Assignee:
POLYPLASTICS CO
International Classes:
C08L59/00; C08K5/3445
Attorney, Agent or Firm:
Satoshi Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa



 
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