Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2011144242
Kind Code:
A
Abstract:

To provide a polyacetal resin composition excellent in suppression of formaldehyde generation, repeated impact resistance, and dimensional stability, after held at high temperature and high humidity.

This polyacetal resin composition is obtained from a raw material composition which includes a polyacetal resin, a first hydrazine derivative (B), and a hydrazine derivative (C) different from the first hydrazine derivative, wherein the mixture of the first hydrazine derivative (B) and the hydrazine derivative (C) different from the first hydrazine derivative does not show a melting point, when it is heated at a rate of temperature rise of 2.5°C/min using a differential scanning calorimeter; held for 2 min after melted; cooled to 100°C at a rate of 10°C/min; and thereafter heated at a rate of temperature rise of 2.5°C/min.


Inventors:
IWAMOTO TAKASHI
Application Number:
JP2010005207A
Publication Date:
July 28, 2011
Filing Date:
January 13, 2010
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L59/00; C08K5/24
Domestic Patent References:
JP2006111874A2006-04-27
JP2000119357A2000-04-25
JP2009029863A2009-02-12
JP2007119698A2007-05-17
JP2001226489A2001-08-21
JPH04233964A1992-08-21