Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2014005385
Kind Code:
A
Abstract:
To provide a polyacetal resin composition that can suppress generation of formaldehyde and contamination of a mold at fabrication.
A polyacetal resin composition includes (B) 0.05-5 parts by mass of a compound shown by the following formula (1) based on (A) 100 mass of a polyacetal resin. In the formula (1), m denotes 0 or 1; n denotes a positive integer; R1 is a (m+n)-valent group, and denotes a 1-40C aliphatic hydrocarbon group or the like; R2 is a univalent group, and denotes a 1-40C aliphatic hydrocarbon group or the like; and Y denotes a hydrazide residue.
Inventors:
NAGAI MASAYUKI
FUJIMOTO KUNIHIKO
NAWATA HIDETOSHI
NIHEI MAKOTO
OKI YASUO
FUJIMOTO KUNIHIKO
NAWATA HIDETOSHI
NIHEI MAKOTO
OKI YASUO
Application Number:
JP2012142537A
Publication Date:
January 16, 2014
Filing Date:
June 25, 2012
Export Citation:
Assignee:
MITSUBISHI ENG PLASTICS CORP
JAPAN FINECHEM CO INC
JAPAN FINECHEM CO INC
International Classes:
C08L59/00; C08K5/22
Attorney, Agent or Firm:
Hiroaki Aoki
Yasuo Morimura
Yasuo Morimura
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