Title:
POLYACETAL RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3221461
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject composition having excellent weather resistance, light resistance and improved heat stability, especially heat stability during molding.
CONSTITUTION: 100 pts.wt. polyacetal resin is mixed with 0.01-0.50 pt.wt. 1,6- bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)-propionamido]hexane and 0.10-1.0 pt.wt. specified ultraviolet absorber or/and 0.10-1.50 pts.wt. light stabilizer, and the resulting mixture is uniformly melt-kneaded.
Inventors:
based on
Satoshi Nagai
Kenichi Shimizu
Toshiaki Okuzono
Satoshi Nagai
Kenichi Shimizu
Toshiaki Okuzono
Application Number:
JP31233392A
Publication Date:
October 22, 2001
Filing Date:
November 20, 1992
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08K5/00; C08L59/00; (IPC1-7): C08L59/00
Domestic Patent References:
| JP63193950A | ||||
| JP5251443A |
Previous Patent: トタン屋根の錆落し器
Next Patent: HIGH STRENGTH AND HIGH EXPANSION ALLOY FOR JUXTAPOSED BIMETAL, ITS PRODUCTION AND HIGH STRENGTH JUXT...
Next Patent: HIGH STRENGTH AND HIGH EXPANSION ALLOY FOR JUXTAPOSED BIMETAL, ITS PRODUCTION AND HIGH STRENGTH JUXT...