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Title:
ポリアセタール樹脂組成物
Document Type and Number:
Japanese Patent JP6814547
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyacetal resin composition, wherein, even when adopting a molding method in which a resin composition is exposed to high temperature for a long time, the pyrolysis of polyacetal resin is suppressed, and the amount of formaldehyde released from an obtained molding and die contamination are also suppressed.SOLUTION: A polyacetal resin composition contains (A) polyacetal resin 100 pts.mass, (B) hindered phenolic compound containing nitrogen of 0.001-0.2 pts.mass, and (C) talc 0.0001-0.1 pts.mass.SELECTED DRAWING: Figure 1

Inventors:
Yukiyoshi Sasaki
Mikio Oka
Makoto Toki
Application Number:
JP2016088465A
Publication Date:
January 20, 2021
Filing Date:
April 26, 2016
Export Citation:
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Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08L59/00; C08K3/34; C08K5/20; C08K5/21; C08K5/24; C08K5/3492; C08L33/26; C08L77/00
Domestic Patent References:
JP1315455A
JP2010514898A
JP2005312801A
JP6179798A
JP2008504397A
JP2012092185A
JP2011052126A
JP2008156628A
JP2009286961A
JP2010006904A
JP2008260923A
JP2015209499A
Foreign References:
WO2016126514A1
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito