Title:
ポリアセタール樹脂組成物
Document Type and Number:
Japanese Patent JP6814548
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyacetal resin composition, wherein, even when adopting a molding method in which a resin composition is exposed to high temperature for a long time, the pyrolysis of polyacetal resin is suppressed, and the amount of formaldehyde released from an obtained molding and die contamination are also suppressed.SOLUTION: A polyacetal resin composition contains (A) polyacetal resin 100 pts.mass, (B) hindered phenolic compound containing nitrogen of 0.001-0.2 pts.mass, (C) hindered phenolic compound containing no nitrogen of 0.001-0.3 pts.mass, and (D) talc 0.0001-0.1 pts.mass.SELECTED DRAWING: Figure 1
Inventors:
Yukiyoshi Sasaki
Mikio Oka
Shuichi Kudo
Mikio Oka
Shuichi Kudo
Application Number:
JP2016088468A
Publication Date:
January 20, 2021
Filing Date:
April 26, 2016
Export Citation:
Assignee:
ASAHI KASEI KABUSHIKI KAISHA
International Classes:
C08L59/00; C08K3/34; C08K5/13; C08K5/20; C08K5/21; C08K5/24; C08K5/3492; C08L33/26; C08L77/00
Domestic Patent References:
JP2010514898A | ||||
JP2005312801A | ||||
JP6179798A | ||||
JP2008504397A | ||||
JP2008156628A | ||||
JP2009286961A | ||||
JP2010006904A | ||||
JP2008260923A | ||||
JP2015209499A |
Foreign References:
WO2016126514A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito