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Patent Searching and Data


Title:
POLYACETAL RESIN MOLDING AND ITS MOLDING METHOD
Document Type and Number:
Japanese Patent JPH10264204
Kind Code:
A
Abstract:

To eliminate external appearance fault such as flow mark, weld line or hesitation mar with excellent weather resistance, wear resistance, heating aging characteristics and satisfactory dimensional accuracy by incorporating a skin layer having a specified maximum thickness on a surface layer of an outer surface.

The polyacetal resin molding has a thickness of a skin layer of an outer surface of 50 μm or less. Used resin is polyacetal resin containing polyacetal resin as a main component, and single polyacetal or a mixture of the polyacetal containing 50 wt.% of more of polyacetal resin and other resin. And, in the molding having a hollow part therein, the part is not formed of a cavity (void) or foaming agent but preferably obtained by a hollow injection molding method. As pressurized fluid used for the hollow injection molding, pressurized gas is used.


Inventors:
FURUYA NORIHIKO
Application Number:
JP7359397A
Publication Date:
October 06, 1998
Filing Date:
March 26, 1997
Export Citation:
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Assignee:
ASAHI CHEMICAL IND
International Classes:
B29C45/00; B29C33/56; B29C45/16; B29C45/17; B29C45/37; B29D24/00; B29K59/00; (IPC1-7): B29C45/16; B29C45/00; B29D24/00