Title:
POLYAMIDE ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2007119661
Kind Code:
A
Abstract:
To provide a polyamide adhesive sheet utilized for flexible print circuit boards having excellent heat resistance, chemical resistance, dimensional stability, electrical characteristics, etc.
The polyamide adhesive sheet having a three-layer structure comprises each epoxy-based adhesive layer having ≤25 μm thickness on both sides of an aromatic polyamide film having ≤10 μm thickness and has ≤50 μm total thickness.
Inventors:
HOSHIDA SHIGEHIRO
SUZUKI SHINJI
AMANO TADASHI
SUZUKI SHINJI
AMANO TADASHI
Application Number:
JP2005315835A
Publication Date:
May 17, 2007
Filing Date:
October 31, 2005
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C09J163/00; B32B27/34; B32B27/38; C09J7/02; C09J11/08; C09J179/08
Domestic Patent References:
| JPS63152644A | 1988-06-25 | |||
| JP2003246016A | 2003-09-02 | |||
| JP2004059663A | 2004-02-26 | |||
| JP2003305792A | 2003-10-28 | |||
| JP2005303274A | 2005-10-27 |
Attorney, Agent or Firm:
Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa
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