Title:
POLYAMIDE COMPOSITION AND MOLDED ARTICLE CONTAINING POLYAMIDE COMPOSITION
Document Type and Number:
Japanese Patent JP2011057798
Kind Code:
A
Abstract:
To provide a polyamide composition excellent in heat resistance, strength, and toughness, and moreover in moldability.
The polyamide includes a polyamide (A), that is obtained by performing polymerization of a dicarboxylic acid (a) containing at least 50 mol% alicyclic dicarboxylic acid and a diamine (b) containing at least 50 mol% diamine having a substituent branched from the main chain, and an amorphous polymer (B).
Inventors:
HINOTO YU
Application Number:
JP2009207374A
Publication Date:
March 24, 2011
Filing Date:
September 08, 2009
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08L77/00; C08G69/02; C08K3/00; C08L101/00
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito