Title:
ポリアミドイミドシロキサンホットメルト接着剤
Document Type and Number:
Japanese Patent JP4640560
Kind Code:
B2
Abstract:
Disclosed is a solution of a hot melt adhesive which comprises an organic solvent and a fully imidized polyamideimidesiloxane. The polyamideimidesiloxane is the reaction product of dianhydride monomer with diamine monomer. About 0.5 to about 30 mole % of the monomers are siloxane-containing diamine or dianhydride monomers. Up to about 50 mole % of the diamine monomer is aliphatic diamine that contains neither siloxane groups nor amide linkages, and about 40 to about 99 mole % of the diamine monomer is aromatic diamine that does not contain siloxane groups. The aromatic diamine is (1) about 50 to about 100 mole % unsymmetrical aromatic diamine that has at least two aromatic rings, two amine groups on different aromatic rings, and contains an amide linkage in the chain and (2) up to about 50 mole % of aromatic diamine that contains neither siloxane groups nor amide linkages. A tape is made by forming a coating of the solution on a film. An article can be attached to a substrate by applying the tape to the substrate or the article, heating the tape above its softening point, and pressing the article or substrate, respectively, into the tape.
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Inventors:
Stevens Dinner
Application Number:
JP2000591137A
Publication Date:
March 02, 2011
Filing Date:
November 08, 1999
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C09J179/08; C08G73/10; C08G73/14; C09J5/06; C09J7/10; C09J183/10
Domestic Patent References:
| JP10060111A | ||||
| JP5331445A | ||||
| JP10158397A |
Attorney, Agent or Firm:
Minoru Nakamura
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda
Fumiaki Otsuka
Sadao Kumakura
Shishido Kaichi
Hideto Takeuchi
Toshio Imajo
Nobuo Ogawa
Village shrine Atsuo
Takaki Nishijima
Atsushi Hakoda