Title:
ポリアミド界面重合用組成物およびそれを用いた逆浸透膜の製造方法
Document Type and Number:
Japanese Patent JP6624278
Kind Code:
B2
Abstract:
The present specification provides a composition for interfacial polymerization of polyamide including at least one of an amine compound and an acyl halide compound; a surfactant; and a compound represented by Chemical Formula 1, and a method for preparing a reverse osmosis membrane using the same.
Inventors:
Hyunbae, Gil
Zeon, Bun Ho
Liu, Huyn
Kim, Yeh
Shin, Jeon Kyu
Zeon, Bun Ho
Liu, Huyn
Kim, Yeh
Shin, Jeon Kyu
Application Number:
JP2018504898A
Publication Date:
December 25, 2019
Filing Date:
March 31, 2017
Export Citation:
Assignee:
LG HAUSYS,LTD.
International Classes:
C08G69/00; B01D69/10; B01D69/12; B01D71/56; C02F1/44
Domestic Patent References:
| JP2013522437A | ||||
| JP55147106A | ||||
| JP2015505863A |
Foreign References:
| WO2016002819A1 |
Attorney, Agent or Firm:
Longhua International Patent Service Corporation