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Title:
POLYAMIDE LAMINATE
Document Type and Number:
Japanese Patent JP2009107183
Kind Code:
A
Abstract:

To provide a polyamide laminate excellent in the adhesive strength between a polyether-polyamide elastomer and a diene-based rubber.

The polyamide laminate is formed by making a polyether-polyamide elastomer layer, which is obtained by polymerizing (A1) an aminocarboxylic acid compound and/or (A2) a lactam compound, (B) a triblock polyether diamine compound, and (C) a dicarboxylic acid compound, overlie the diene-based rubber.


Inventors:
OKUSHITA YOJI
MAEDA SHUICHI
AKAGAWA YOSHIFUMI
ENOMOTO TATSUYA
MORIYAMA TOSHIO
Application Number:
JP2007280705A
Publication Date:
May 21, 2009
Filing Date:
October 29, 2007
Export Citation:
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Assignee:
UBE INDUSTRIES
International Classes:
B32B25/04; B32B25/16; C08G69/36
Domestic Patent References:
JPS61111732U1986-07-15
JP2004042486A2004-02-12
JP2004352796A2004-12-16
JP2004161964A2004-06-10
JP2007216387A2007-08-30
Attorney, Agent or Firm:
Makoto Kataoka
Tamotsu Otani