PURPOSE: To especially enhance heat resistance and dimensional stability by biaxially stretching a film composed of polyamide having an m.p. of a definite value or more under a specific condition.

CONSTITUTION: A film having a conductive metal layer laminated to at least single surface thereof is formed. This film is composed of polyamide having an m.p. of 270°C or higher based on hexamethylenediamine as a diamine component and adipic acid and terephthalic acid as dicarboxylic acid components. The polyamide film is a biaxially stretched film whose dry heat shrinkage factor under a 160°C×15min measuring condition is (-0.5)-(+0.5)% in both of the longitudinal and lateral directions within the film surface and pref. prepared by combining a non-stretched film mfg. process according to a melt film forming method, a simultaneous biaxial stretching process according to a flat method and a heat treatment process. As the conductive metal layer, copper and aluminum are used and a copper foil is especially pref. This metal layer is usually laminated to the polyamide biaxially stretched film by an adhesive.