POLYAMIDE RESIN COMPOSITION FOR FILM

Title:

POLYAMIDE RESIN COMPOSITION FOR FILM

Document Type and Number:

Japanese Patent JPH0873734

Kind Code:

A

Abstract:

PURPOSE: To obtain a film having an excellent slipperiness and a good appearance while retaining various characteristics inherent in a polyamide resin film with good productivity by using a polyamide resin together with an inorganic filler and a mixture of zinc oxide and a basic magnesium salt of a fatty acid.

CONSTITUTION: This polyamide resin composition is obtained by mixing 100 pts.wt. polyamide resin, 0.05-0.5 pt.wt. inorganic filler and 0.03-0.5 pt.wt. additive containing zinc oxide and a basic magnesium salt of a fatty acid at a weight ratio of (10:90) to (30:70).

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Inventors:

NONAKA HIROFUMI
KANESHIGE TOYOHISA
NAKAO SHINICHI

Application Number:

JP20973094A

Publication Date:

March 19, 1996

Filing Date:

September 02, 1994

Export Citation:

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Assignee:

UBE INDUSTRIES

International Classes:

C08J5/18; C08K3/00; C08K3/22; C08K5/098; C08L77/00; (IPC1-7): C08L77/00; C08J5/18; C08K3/00; C08K3/22; C08K5/098

Next Patent: POLYAMIDE RESIN COMPOSITION FOR OPTICAL PART, AND PART FOR OPTICAL COMMUNICATION