Title:
POLYAMIDE RESIN COMPOSITION AND MOLDED ARTICLE COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2017190407
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in all of heat dissipation, electrical insulation, and impact resistance.SOLUTION: The polyamide resin composition contains a polyamide resin (A), an insulating thermally conductive filler (B1), a graphite-based thermally conductive filler (B2), and aramid fibers (C). The mass ratio [(A)/{(B1)+(B2)}] of the polyamide resin (A) to the total of the insulating thermally conductive filler (B1) and the graphite-based thermally conductive filler (B2) is 15/85-80/20. The mass ratio [(B1)/(B2)] of the insulating thermally conductive filler (B1) to the graphite-based thermally conductive filler (B2) is 95/5-65/35. The aramid fibers (C) are contained in an amount of 3-30 pts.mass based on 100 pts.mass of the total of the polyamide resin (A), the insulating thermally conductive filler (B1), and the graphite-based thermally conductive filler (B2).SELECTED DRAWING: None
Inventors:
MASAI YUYA
Application Number:
JP2016081115A
Publication Date:
October 19, 2017
Filing Date:
April 14, 2016
Export Citation:
Assignee:
UNITIKA LTD
International Classes:
C08L77/00; C08K3/04; C08K3/34; C08K3/38; C08L93/04
Domestic Patent References:
| JP2010535876A | 2010-11-25 | |||
| JP2008214398A | 2008-09-18 | |||
| JP2014523449A | 2014-09-11 | |||
| JP2016006146A | 2016-01-14 | |||
| JP2010116518A | 2010-05-27 | |||
| JP2009292889A | 2009-12-17 | |||
| JPH10251443A | 1998-09-22 |
Foreign References:
| US20080153959A1 | 2008-06-26 | |||
| US20140048841A1 | 2014-02-20 | |||
| WO2013069365A1 | 2013-05-16 |
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