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Patent Searching and Data


Title:
POLYAMIDE RESIN COMPOSITION FOR MOLDING
Document Type and Number:
Japanese Patent JPS6023446
Kind Code:
A
Abstract:

PURPOSE: To produce a composition having remarkably improved physical properities such as tensile strength, flexural strength, etc. and improved heat-deformation temperature and moldability, and capable of forming an ultra-high precision part, by compounding a xylylenediamine polyamide resin, nylon 66 and potassium titanate single crystal fibers.

CONSTITUTION: The objective composition is produced by compounding (A) 55W90(wt)% xylylenediamine polyamide resin, (B) 5W15% nylon 66 and (C) 5W 40% potassium titanate single crystal fibers. The component C has an average fiber diameter of ≤1μ, average fiber length of 5W100μ, and a ratio of average fiber length to average fiber diameter of ≥10, and is preferably treated with 0.3W5% surface-treatment agent (epoxysilane or aminosilane coupling agent), based on the weight of the fiber.


Inventors:
TASAKA TAKIO
NOMURA ISAO
Application Number:
JP13069083A
Publication Date:
February 06, 1985
Filing Date:
July 18, 1983
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
OTSUKA KAGAKU YAKUHIN
International Classes:
C08K7/08; C08K9/04; C08L67/00; C08L67/06; C08L77/00; C08L77/06; (IPC1-7): C08K7/08; C08L77/06