Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2001234066
Kind Code:
A
Abstract:
To obtain a polyamide resin composition having a slow crystallizing rate and good drawability while hardly causing the reduction of the melting point of the polyamide component constituting the main component.
This polyamide resin composition comprises 100 pts.wt. polyamide resin and 0.05-10 pts.wt. rhodinic acids.
Inventors:
HIRANO TETSUHARU
TANAKA SHOICHI
OKUSHITA YOJI
TANAKA SHOICHI
OKUSHITA YOJI
Application Number:
JP2000047458A
Publication Date:
August 28, 2001
Filing Date:
February 24, 2000
Export Citation:
Assignee:
UBE INDUSTRIES
International Classes:
C08J5/00; C08J5/18; C08L77/00; C08L93/04; D01F6/90; (IPC1-7): C08L77/00; C08J5/00; C08J5/18; C08L93/04; D01F6/90
Previous Patent: COMPOSITION COMPRISING POLYAMIDE RESIN
Next Patent: FIBER REINFORCED THERMOPLASTIC RESIN COMPOSITION FOR RESIN WHEEL AND RESIN WHEEL
Next Patent: FIBER REINFORCED THERMOPLASTIC RESIN COMPOSITION FOR RESIN WHEEL AND RESIN WHEEL