Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2002294069
Kind Code:
A
Abstract:
To provide a continuously moldable polyamide resin composition having high rigidity and gloss of the molded article and free from the tearing trouble of sprue and provide a molded article of the composition.
The polyamide resin composition contains (A) 30-70 pts.wt. of a polyamide containing an aromatic ring-containing polymer unit and 30-70 pts.wt. in total of (B) glass fiber and (C) wollastonite (the sum of A, B and C is 100 pts.wt. and the C/B weight ratio is 0.2-3), (D) carbon black, (E) a copper compound, (F) 0.01-5 pts.wt. (based on 100 pts.wt. of the component A) of calcium salt, lithium salt or sodium salt of a ≥28C fatty acid and (G) an azine dye. The present invention further provides a molded article of the resin composition.
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Inventors:
OYAMADA HIROSHI
KAI SHINICHI
KAI SHINICHI
Application Number:
JP2001100879A
Publication Date:
October 09, 2002
Filing Date:
March 30, 2001
Export Citation:
Assignee:
ASAHI KASEI CORP
International Classes:
B62D25/06; B60B7/00; B60J5/04; B62D37/02; C08J5/00; C08K3/04; C08K3/10; C08K3/34; C08K5/098; C08K5/3462; C08K7/14; C08L77/00; (IPC1-7): C08L77/00; B60B7/00; B60J5/04; B62D25/06; B62D37/02; C08J5/00; C08K3/04; C08K3/10; C08K3/34; C08K5/098; C08K5/3462; C08K7/14
Domestic Patent References:
| JP2002097363A | 2002-04-02 | |||
| JP2000273299A | 2000-10-03 | |||
| JPH11279399A | 1999-10-12 |
Foreign References:
| WO2000032693A1 | 2000-06-08 |