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Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2009001746
Kind Code:
A
Abstract:

To provide a resin composition composed mainly of a polyamide and an ABS resin, which excels in low water absorption, dimensional stability, mechanical properties at water absorption, heat resistance, moldability and chemical resistance and also has a low specific gravity, and to provide a resin molded product consisting thereof.

The resin composition is obtained by melt-kneading 5-20 parts by mass of an acid-modified styrene-based elastomer, 0.05-5 parts by mass of an unsaturated carboxylic acid, unsaturated dicarboxylic acid or acid anhydride thereof and 0.01-3 parts by mass of a radical generator, based on 100 parts by mass of a polyamide/ABS resin composition which consists of 40-80% by mass of a polyamide containing 0.01-20% by mass of a swelling fluorine mica type mineral, obtained by polymerizing the monomer under co-existence of the swelling fluorine mica type mineral, and 60-20% by mass of an ABS resin.


Inventors:
FUJII SHIGETA
Application Number:
JP2007166267A
Publication Date:
January 08, 2009
Filing Date:
June 25, 2007
Export Citation:
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Assignee:
UNITIKA LTD
International Classes:
C08L77/00; B63B5/24; C08K3/34; C08K5/09; C08L55/02
Domestic Patent References:
JPH03255152A1991-11-14
JPH0812882A1996-01-16
JP2008208168A2008-09-11
JPH0812883A1996-01-16
JPH083439A1996-01-09
JP2006290961A2006-10-26
JPH0578550A1993-03-30