Title:
POLYAMIDE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2019019305
Kind Code:
A
Abstract:
To provide a polyamide resin composition that is excellent in releasability during continuous molding, die stain resistance (low gasssing), bleedout under hygrothermal environment, blister resistance at increased temperature, thermal aging resistance (welding burst strength at high temperature after heat treatment, creep strain at high temperature after heat treatment), and surface smoothness after heat aging.SOLUTION: A polyamide resin composition contains, based on polyamide resin (A) 100 pts.mass, a hydroxy group-containing compound (B) containing at least three hydroxy groups in one molecule of 0.1-20 pts.mass, and a cyclic compound (C) represented by the following formula [1] of 0.001-1 pts.mass. In the formula [1]: QX, Q is an aromatic hydrocarbon group or alicyclic hydrocarbon group, X is a 5 membered or 6 membered heterocyclic group.SELECTED DRAWING: None
Inventors:
NISHIDA SHINGO
MORIOKA NOBUHIRO
AKITA DAI
UMEZU HIDEYUKI
MORIOKA NOBUHIRO
AKITA DAI
UMEZU HIDEYUKI
Application Number:
JP2018055961A
Publication Date:
February 07, 2019
Filing Date:
March 23, 2018
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08L77/00; C08G59/14; C08G73/00; C08K3/10; C08K5/053; C08K5/37; C08K5/47; C08L63/00; C08L79/08