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Title:
POLYAMIDE RESIN-CONTAINING VARNISH AND ITS USE
Document Type and Number:
Japanese Patent JP2002129101
Kind Code:
A
Abstract:

To provide a polyamide resin varnish which is easy to remove a solvent on forming films and can obtain films and adhesive layers reduced in the remaining solvent.

The polyamide resin-containing varnish comprises (A) a phenolic hydroxyl group-containing aromatic polyamide resin, and (B) a solvent to be represented by the formula: R1O(R2O)nR3 (wherein R1 and R3 are each a 1-4C alkyl group; R2 is a 2C or 3C alkylene group; and (n) is 2, 3 or 4).


Inventors:
ASANO TOYOFUMI
KOYANAGI TAKAO
IMAIZUMI MASAHIRO
NIIMOTO HARUKI
Application Number:
JP2000320452A
Publication Date:
May 09, 2002
Filing Date:
October 20, 2000
Export Citation:
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Assignee:
NIPPON KAYAKU KK
International Classes:
C08L53/00; C08L63/00; C09D5/00; C09D153/00; C09D163/00; C09D177/00; C09D201/00; C09J7/00; C09J153/00; C09J163/00; C09J177/00; C09J201/00; (IPC1-7): C09D177/00; C08L53/00; C08L63/00; C09D5/00; C09D153/00; C09D163/00; C09D201/00; C09J7/00; C09J153/00; C09J163/00; C09J177/00; C09J201/00
Domestic Patent References:
JPH059366A1993-01-19
JPH03234722A1991-10-18
JPH0525270A1993-02-02
JPH09124801A1997-05-13
JPH04202224A1992-07-23
JP2000327914A2000-11-28
JP2001220557A2001-08-14
JP2001123132A2001-05-08
JPH10330480A1998-12-15
JPH10279679A1998-10-20
JPH08143661A1996-06-04
JPH03247655A1991-11-05
JPH08217959A1996-08-27
JPH0532761A1993-02-09
JPH09176485A1997-07-08
JPH10287806A1998-10-27
JPH0347836A1991-02-28
JPH04253728A1992-09-09



 
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