Title:
POLYAMIDE RESIN FILAMENT
Document Type and Number:
Japanese Patent JP2001032132
Kind Code:
A
Abstract:
To provide a polyamide resin filament having excellent transparency and mechanical strengths.
The objective polyamide resin filament is composed of a polyamide resin containing -caprolactam as a principal constituent component and containing ≤10.0 wt.% molecules having a molecular weight of 1,000-10,000 based on 100 wt.% of molecules having a molecular weight of ≥1,000 in terms of polystyrene measured by gel permeation chromatography.
Inventors:
MIYAMOTO MASAAKI
YAMAMOTO MASANORI
YAMAMOTO MASANORI
Application Number:
JP20267199A
Publication Date:
February 06, 2001
Filing Date:
July 16, 1999
Export Citation:
Assignee:
MITSUBISHI CHEM CORP
International Classes:
C08G69/14; D01F6/60; D01F6/90; (IPC1-7): D01F6/60; C08G69/14; D01F6/90
Attorney, Agent or Firm:
Hasegawa Moji