To provide a polyamideimide resin composition having heat resistance equal to that of a polyamideimide resin, properties softer than that of general use polyamideimide, having tensile strength which is a mechanical property, equal to elastic modulus, curable at low temperature and hardly reducing adhesivity with a substrate by modifying the substrate, and to provide a paint, coating paint or its binder resin using the composition.
The polyamideimide resin composition comprises a polyamideimide resin obtained by reaction of (a) a derivative of trivalent carboxylic acid having an acid anhydride group, (b) a dicarboxylic acid represented by a specific general formula and (c) an aromatic polyisocyanate represented by a specific general formula.
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