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Title:
POLYARAMID SILOXANE BASED THERMORESISTANCE ADHESIVE
Document Type and Number:
Japanese Patent JPH07292342
Kind Code:
A
Abstract:

PURPOSE: To obtain the subject adhesive containing a specific polyaramid siloxane resin and an organic solvent, having excellent workability during application and storage stability, excellent in heat resistance, moisture resistance, etc., and exhibiting excellent adhesivity to glass, etc.

CONSTITUTION: This adhesive is produced by compounding (A) a polyaramid siloxane resin prepared by polycondensation of an aromatic amide oligomer of formula I [X is OH, Cl, etc.; Ar1 and Ar2 each is a divalent aromatic group; (m)=1-50] with a diaminosiloxane of formula II [R1 and R2 each is a 1-5C divalent aliphatic or aromatic group; R3 and R4 each is a monovalent aliphatic or aromatic group; (n)=1-100] and containing a diaminosiloxane unit in an amount of 10-50wt.% and (B) an organic solvent (preferably dimethyl sulfoxide, etc.) preferably in the ratio of 10g of the component A against 50-500ml of the component B. Further, the preparation of the oligomer of formula I is preferably carried out by using isophthalic acid as the aromatic dicarboxylic acid.


Inventors:
AKASHI MITSURU
SEKI KOUJI
KISHIMOTO MAMORU
NAGATA KAZUSHI
WAKI KAZUNORI
KOINUMA YASUYOSHI
Application Number:
JP9013194A
Publication Date:
November 07, 1995
Filing Date:
April 27, 1994
Export Citation:
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Assignee:
NIPPON DENPUN KOGYO KK
NIPPON OILS & FATS CO LTD
International Classes:
C08G69/42; C09J177/00; C09J177/06; C09J183/00; C09J183/10; (IPC1-7): C09J177/06; C08G69/42; C09J183/10
Attorney, Agent or Firm:
Hajime Sakai (1 person outside)