Title:
ポリマー－金属接合用のポリ（アリールエーテル）組成物ならびにポリマー－金属接合および相当する製造方法
Document Type and Number:
Japanese Patent JP7158854
Kind Code:
B2
Abstract:
Adhesive compositions are described that significantly improve the adhesion of polymer overmold compositions to metal substrates in polymer-metal junctions. The adhesive compositions include one or more poly(aryl ether) polymers, where each of the poly(aryl ether) polymers is, independently, a poly(aryl ether sulfone) polymer or a poly(aryl ether ketone) polymer. The overmold composition includes at least one poly(aryl ether ketone) polymer. Polymer-Metal junctions can be formed by, for example, dip-coating, spin-coating, extruding, or injection molding the adhesive composition and/or the overmold composition onto the metal substrate. Desirable applications settings for the polymer-metal junctions described include, but are not limited to electrical wiring.
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Inventors:
El-Hibri, Mohammad Jamal
Lewis, Chantal
Hammons, Ryan
Lewis, Chantal
Hammons, Ryan
Application Number:
JP2017531313A
Publication Date:
October 24, 2022
Filing Date:
December 11, 2015
Export Citation:
Assignee:
Solvay Specialty Polymers USA, LLC
International Classes:
B32B15/08; C08G65/40; C09J171/00; C09J181/06; H01B3/30; H01B7/02
Domestic Patent References:
| JP292632A | ||||
| JP2010123390A | ||||
| JP2000272049A | ||||
| JP10202786A |
Foreign References:
| WO2014037374A1 | ||||
| WO2014072447A1 |
Attorney, Agent or Firm:
Sonoda & Kobayashi Patent Attorneys Corporation