Title:
ポリアリーレンエーテル樹脂、ポリアリーレンエーテル樹脂の製造方法、硬化性樹脂材料、その硬化物、半導体封止材料、半導体装置、プリプレグ、プリント回路基板、ビルドアップフィルム、ビルドアップ基板、繊維強化複合材料、及び繊維強化成形品
Document Type and Number:
Japanese Patent JP6690121
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polyarylene ether resin excellent in various physical properties of heat resistance, pyrolytic property, moisture resistance and solder resistance, flame retardancy and dielectric property, a manufacturing method of the resin, a cured article thereof, a semiconductor encapsulation material, a semiconductor device, a prepreg, a print circuit board, a build-up film, a build-up substrate, a fiber-reinforced composite material and a fiber-reinforced molded article.SOLUTION: There is provided a polyarylene ether resin having a polyarylene ether structure in a molecular structure, where at least one aromatic nuclear thereof has a naphthalene ring structure and at least one aromatic nuclear thereof has two benzoxazine skeletons obtained by reacting the polyarylene ether, an aromatic monohydroxy compound, a diamine compound and formaldehyde.SELECTED DRAWING: None
Inventors:
Tomohiro Shimono
Kazuo Arita
Kazuo Arita
Application Number:
JP2014261947A
Publication Date:
April 28, 2020
Filing Date:
December 25, 2014
Export Citation:
Assignee:
DIC Corporation
International Classes:
C08G14/073; C07D265/12; C07D265/16; C08G65/48; C08J5/04; C08J5/18; C08J5/24; C08L61/34; C08L71/08; H01L23/29; H01L23/31; H05K1/03; H05K3/46
Domestic Patent References:
| JP5835528B2 |
Attorney, Agent or Firm:
Shinji Ogawa
Akihiro Iwamoto
Takayuki Ohno
Akihiro Iwamoto
Takayuki Ohno