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Patent Searching and Data


Title:
POLYARYLENE SULFIDE RESIN MOLDED PRODUCT
Document Type and Number:
Japanese Patent JP2021024883
Kind Code:
A
Abstract:
To provide a PAS resin molded product in which the occurrence of mold deposits and burrs may be reduced while maintaining toughness even if a hollow columnar section and an undercut section are included.SOLUTION: A PAS resin molded product formed by molding PAS resin composition includes a hollow columnar section and an undercut section. The resin composition contains 0.3 to 0.6 parts by mass of alkoxysilane compound with respect to 100 parts by mass of the PAS resin and 4 to 10 parts by mass of at least one of olefin-based copolymers. At least one of olefin-based copolymers is an olefin-based copolymer having a reactive group. The content of the reactive group is 5.0 mmol/kg or more. The ratio of the total content (mmol/kg) of the reactive group and the alkoxysilane compound relatively to the nitrogen content (mmol/kg) in the PAS resin is 0.7 to 0.95.SELECTED DRAWING: None

Inventors:
MORIYA SHOTARO
Application Number:
JP2019141088A
Publication Date:
February 22, 2021
Filing Date:
July 31, 2019
Export Citation:
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Assignee:
POLYPLASTICS CO
International Classes:
C08L81/02; B29C45/44; C08K3/013; C08K5/544; C08L23/08
Domestic Patent References:
JP2008075003A2008-04-03
JP2006143827A2006-06-08
JP2013112783A2013-06-10
Attorney, Agent or Firm:
Hidekazu Miyoshi
Shunichi Takahashi
Masakazu Ito
Toshio Takamatsu