POLYBUTYLENE TEREPHTHALATE RESIN COMPOSITION AND MOLDING

Japanese Patent JP3929889

B2

PROBLEM TO BE SOLVED: To obtain a polybutylene terephthalate resin composition with excellent moldability and mold releasability, which gives a molding exhibiting very good appearance and paintability in addition to high rigidity.
SOLUTION: The polybutylene terephthalate resin composition is obtained by formulating 40-150 pts.wt. of mixed fillers ((C) + (D)) comprising (C) a glass fiber and (D) one or more fillers selected from (D-1) an acicular filler having 40-200μm average fiber length and (D-2) a granular or platy filler having 5-60μm particle size, and (E) 0.1-5 pts.wt. of an ester compound comprising a ≥26C aliphatic carboxylic acid as a main constituent to 100 pts.wt. of a resin component comprising (A) 95-55 wt.% of a modified polybutylene terephthalate resin containing 5-30 mol% isophthalic acid unit and having 0.60-0.80 intrinsic viscosity (IV) and (B) 5-45 wt.% of a polycarbonate resin.

JP2001089577	STRUCTURE HAVING EFFECT FOR PREVENTING ATTACHMENT OF AQUATIC LIFE
JP2722266	[Title of Invention] Molding Resin Composition

Fumiyuki Otake

JP2002377699A

June 13, 2007

December 26, 2002

Click for automatic bibliography generation  

Wintech Polymer Co., Ltd.

C08L67/02; E05B1/00; B60J5/04; B60R1/00; B60R1/06; B60S1/34; B60S1/38; C08K3/34; C08K5/10; C08K7/00; C08K7/02; (IPC1-7): C08L67/02; B60J5/04; B60R1/00; B60R1/06; B60S1/34; B60S1/38; C08K5/10; C08K7/02; E05B1/00; //(C08L67/02; C08L69:00)

JP2000212294A
JP63132961A
JP4004249A
JP7126496A
JP5339481A
JP59006250A
JP52121659A
JP4001028B2
JP58019697B1

Satoshi Furuya
Kaoru Furuya
Takahiko Mizobe
Shinji Mochida
Yoshitsune Kazumasa

Previous Patent: IC CARD, UNAUTHORIZED USE PREVENTION METHOD FOR IC CARD, AND PROGRAM

Next Patent: METHOD FOR PRODUCING DIGLYCERIDE