To provide a polyester resin excellent in latent heat curability, long-term storage stability, adhesion, and fluidity required in bonding; a modified polyester resin using the same and having ethylenically unsaturated double bonds; and a photocurable-heat-curable resin composition using these.
The polyester resin C includes an oxetane ring-containing segment based on an oxetane ring-containing diol oligomer A1 having at least two oxetane rings and hydroxyl groups at both ends, an ester bond-containing segment based on an ester bond-containing diol oligomer A2 having at least two ester bonds and hydroxyl groups at both ends, and a residual carboxyl group-containing segment B based on an acid dianhydride. The polyester resin C includes a number average molecular weight of 1,000-10,000.
OGI KOJI
KAWAKUSU TETSUO
