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Title:
POLYETHYLENE RESIN COMPOSITION AND FILM PREPARED THEREFROM
Document Type and Number:
Japanese Patent JP3391531
Kind Code:
B2
Abstract:

PURPOSE: To obtain a resin composition improved in blocking resistance and slip properties and capable of providing films which hardly adhere to each other to have flaws by compounding a polyethylene resin with powder of a cross-linked acrylic resin or powder of a cross-linked silicone resin.
CONSTITUTION: A polyethylene resin composition contains 0.05 to 2 parts by weight powder of a cross-linked acrylic resin or powder of a cross-linked silicone resin, based on 100 parts by weight polyethylene resin. In this case, the polyethylene resin having a density of normally 0.940g/cm3 or less, preferably 0.900 to 0.935g/cm3 is used. When the density is higher than 0.940g/cm3 the low-temperature or high-speed heat sealability tends to lower when the film prepared therefrom is used with nylon or the like in the form of a composite film as a wrapping material. The cross-linked acrylic resin powder or the cross- linked silicone resin powder is the cross-linked resin powder which will not be molten ar film-forming temperatures fo polyethylene resins, e.g. 130 to 350°C.


Inventors:
Satoru Koyama
Ryoichi Nomura
Satoru Hosoda
Application Number:
JP32664193A
Publication Date:
March 31, 2003
Filing Date:
December 24, 1993
Export Citation:
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Assignee:
Sumitomo Chemical Co., Ltd.
International Classes:
C08J5/18; C08K7/16; C08L23/04; C08L29/00; C08L87/00; (IPC1-7): C08L23/04; C08J5/18; C08K7/16
Domestic Patent References:
JP5051142A
JP57131254A
JP62215646A
JP4189837A
Attorney, Agent or Firm:
Takashi Kuboyama