Title:
POLYETHYLENE RESIN COMPOSITION AND ITS USE
Document Type and Number:
Japanese Patent JP3967507
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain the subject composition capable of preventing the generation of a deposited resin at the outlet of an extruder even on performing high speed molding or a long run molding in its film formation, extrusion molding or hetromorphic extrusion molding, and preparing a molded material excellent in surface smoothness e.g. the above extrusion molded materials, and further capable of preparing a film, sheet, pipe, or the like.
SOLUTION: This polyethylene resin composition contains a polyethylene resin, a fluorine-based resin, and as necessary a phenol-based stabilizer and/or phosphorus-based stabilizer. The polyethylene resin has 0.919-0.970 g/cm3 density, 0.01-1.00 g/10 min MFR (190°C) and 15-50 Mw/Mn measured by a GPC, and the polyethylene resin composition is characterized by satisfying a relationship; FI≥1,500×MFR with a flow index [FI (1/sec)] defined by a shear rate of the molten polymer at 190°C on attaining 2.4×106 dyne/cm2 and MFR (g/10 min). The extrusion-molded material consists of the above composition, and the film, sheet and pipe are also prepared by using the above composition.
Inventors:
Komiya Miki
Inoue Kensei
Inoue Kensei
Application Number:
JP35858499A
Publication Date:
August 29, 2007
Filing Date:
December 17, 1999
Export Citation:
Assignee:
Mitsui Chemicals, Inc.
International Classes:
C08J5/00; C08L23/04; B29C47/00; C08K5/13; C08K5/524; F16L11/04; B29K23/00; B29L7/00; (IPC1-7): C08L23/04; C08J5/00; C08K5/13; C08K5/524; //B29C47/00; (C08L23/04; C08L27:12); B29K23:00; B29L7:00
Domestic Patent References:
| JP9255820A | ||||
| JP8239521A | ||||
| JP4370127A | ||||
| JP2000290440A |
Attorney, Agent or Firm:
Shunichiro Suzuki
Koji Makimura
Koji Makimura