Title:
POLYIMIDE ADHESIVE COMPOSITION AND POLYIMIDE ADHESIVE TAPE
Document Type and Number:
Japanese Patent JP2006124637
Kind Code:
A
Abstract:
To provide a polyimide adhesive composition which excels in insulating properties and heat resistance, improves high temperature adhesion properties, and excels in adhesion properties to a coating layer of mutually different materials formed on a substrate layer, and a polyimide adhesive tape using this polyimide adhesive composition.
The polyimide adhesive composition is constituted of (A) a tetracarboxylic dianhydride, (B) a diamine, (C) a diamine containing a siloxane structure, (D) a polyamino compound of any one kind or in a mixed form of two or more kinds selected from the group consisting of a triamine and a tetraamine, and (E) 3,4-diaminobenzoic acid.
Inventors:
JANG GYEONG HO
KIM GWANG MU
KWON JEONG MIN
LEE GYEONG ROK
PARK DOKU HA
KIM GWANG MU
KWON JEONG MIN
LEE GYEONG ROK
PARK DOKU HA
Application Number:
JP2005093661A
Publication Date:
May 18, 2006
Filing Date:
March 29, 2005
Export Citation:
Assignee:
SAEHAN MICRONICS INC
International Classes:
C09J179/08; C09J7/02; C09J183/10
Attorney, Agent or Firm:
Tsuyoshi Hashimoto
Tomioka Kiyoshi
Tomioka Kiyoshi